Function needs

To implement driver assistance and clutch control functions, sensors are required to monitor the clutch postion or status and send the information to the electronic control system.

Depending on the type of transmission, the position or status of the clutch is generally detected via the position of the master and/or slave cylinder, the clutch release bearing or the clutch pedal.

Sensors needs

The sensors that provide this information must offer:

• High accuracy
• Small size
• Fast response
• Easy integration
• High reliability
• Diagnostic capabilities

Depending on where they are installed, they must also withstand severe environmental conditions:

• High temperatures
• Rapid temperature fluctuations
• Electromagnetic disturbances
• Vibrations
• Corrosive liquids

Integration

To offer more functions with higher reliability and lower cost, the trend is towards higher levels of integration for control systems. Various types of sensors can be combined in sensor clusters or in mechatronic modules that include processing, actuation and communication functions.
For instance, in today's electronic transmissions, sensors, actuators and the transmission control unit (TCU) can be combined in a single mechatronic module installed inside the gearbox and immersed in oil. Advantages include simplifi ed wiring, connection and sealing, easy assembly and improved quality and process control.

Electricfil solutions

Electricfil Automotive masters all leading sensor technologies to produce optimum sensing solutions for every need. The solution path is based on more than 25 years of experience in the fi eld.

• Analysis of customer needs to select the most suitable sensor type from our proven core technologies (LVDT, Hall, Eddy-Current, GMR, AMR, VR, etc.)
• Determination of degree of integration (single sensor, sensor cluster or mechatronic module)
• Circuit design and ASIC developmentif required
• Selection of electronic components and assembly technology (e.g. surface mounted devices, discrete components)
• Package design, including the selection of materials (PA, PPS, PBT, etc.), assembly process (laser, thermal or vibration welding), potting, overmolding and encapsulation techniques, sizing, etc.
• Selection of interconnections (leadframe, fl ex foil, cable harness, etc.)
• Magnetic circuit design(magnet materials, pole piece dimensions, etc.)
• FMEA, reliability studies, computer simulations, prototyping, initial samples, etc.