Context
In today's automotive world, driving comfort, safety and fuel economy
are key objectives. Sensing solutions for advanced electronic control
systems help meet these needs.
Clutch, brake and accelerator pedal position are used by electronic control
units (ECU) to implement functions such as:
- Brake-by-wire
- Shift-by-wire
- Clutch-by-wire
- Electronic throttle control
- Optimization of fuel injection and ignition timing
- Hill-holder
- Start lock
- Keyless start
- Automatic parking brake release
- Cruise control
- Anti-stall function
- Clutch-riding alarm
- Clutch position indication
- Brake light switch
Each of these functions relies on specific sensing solutions that require a high
level of know-how in the field.
Electricfil masters all the leading sensor technologies to bring you
the right sensing solution for your every need.
Function needs
To implement X-by-wire and a number of driver assistance
functions, sensors are required to monitor the clutch, brake and
accelerator pedal position and send the information to electronic
control systems.
This can be done by various types of position sensors or switches
located on or near the pedals or their operating mechanisms.
Sensors needs
The sensors that provide this information must offer:
- High accuracy
- Small size
- Fast response
- Easy integration
- High reliability
- Diagnostic capabilities
Depending on where they are installed, they must also
withstand severe environmental conditions:
- High temperatures
- Rapid temperature fluctuations
- Electromagnetic disturbances
- Vibrations
- Corrosive liquids
Electricfil solutions
Electricfil Automotive masters all leading sensor technologies to
produce optimum sensing solutions for every need. The solution
path is based on more than 25 years of experience in the field.
- Analysis of customer needs to select the most suitable
sensor type from our proven core technologies
(LVDT, Hall, Eddy-Current, GMR, AMR, VR, etc.)
- Determination of degree of integration (single sensor, sensor
cluster or mechatronic module)
- Circuit design and ASIC development if required
- Selection of electronic components and assembly technology
(e.g. surface mounted devices, discrete components)
- Package design, including the selection of materials
(PA, PPS, PBT, etc.), assembly process (laser, thermal
or vibration welding), potting, overmolding and encapsulation
techniques, sizing, etc.
- Selection of interconnections (leadframe, flex foil,
cable harness, etc.)
- Magnetic circuit design (magnet materials, pole piece
dimensions, etc.)
- FMEA, reliability studies, computer simulations, prototyping,
initial samples, etc.